Thermal conductive paste.
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Jonas Carlsson
Director of Global Sales - Automotive
+46 708 12 99 95
STANDARD PRODUCT
Compatherm® Paste
COMPATHERM® PASTE
Thermal conductive paste
Compatherm Paste comes under the thin-bond-line category of TIMs. It creates the thinnest possible film between the heat source and heat sink to provide minimal thermal resistance. Compatherm Paste allows a bond line thickness of as little as a few tenths of a micron.
compatherm® paste benefits
- Very high thermal performance due to ultra-thin bond line
- Allows bond lines down to tenths of microns
- Dispensable and silk/stencil screen printable
- Stable composition with no dry-out
compatherm® paste material matrix & datasheets
| Test standard | Unit | 9532 | 9543 | ||||
| Base matrix | Silicone |
Silicone | |||||
| Thermally conductive filler | Ceramic | Ceramic, AI | |||||
| Color | Visual | White | Grey | ||||
| Thermal Conductivity | ISO 22007-2 mod | W/(m-K) | 2.5 | 4.3 | |||
| Viscosity | Brookfield 10rpm | cP |
110 000 | 250 000 | |||
| Density | ASTM D792 | g/cm^3 |
2.68 | 2.3 | |||
| Dielectric Breakdown Voltage | ASTM D149 | VAC/mm |
4000 | 400 | |||
| Volatile Content | ASTM E595 (mod.) | % |
0.3 | 0.3 | |||
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