Our expertise and experience in assembly solutions allow us to always offer the right degree of automation.
Contact us
Sending Email...
Contact person/s
Patrik Ingvarsson
Technical Design Center - Europe
SERVICE
Assembly solutions
Nolato offers an array of assembly and joining technologies, including ultrasonic and vibration welding, heat staking, gluing, laser bonding and mechanical press-fit
Assembly of components
The technology we use allows parts to be assembled with great precision in applications where long service life is critical.
Capabilities
Our capabilities cover the entire spectrum of working with, around and beyond polymer-based materials.
Multiple processes
We also offer continuous motion assembly, in which multiple processes occur without interruption of each cycle and effectively overlap.
Offering
Our offering includes cam-driven, indexed systems in HSAM (high-speed assembly) applications.
Support
We support you in delivering time-sensitive, precision, high-quality and competitive solutions for you and your end users.
Synchronization
Cam-drives ensure perfect synchronization between working units.
TECHNOLOGY
All levels
We offer an array of assembly and joining technologies that are used at all levels, from manual to HSAM.
PRODUCTION
High volume
With capacity of up to 1,200 pcs per minute, assembly and automation is well suited to very high-volume production.
You might also be interested in
MEDICAL EXCELLENCE
Creating world-class operations
Medical Excellence is our way of creating world class operations inspired by the Nolato spirit, our strategies, quality standards and our lean processes and tools. Together, these elements create a framework for managing resources efficiently and increasing value for our customers.
SERVICE
Extrusion
We offer extrusion of medical-grade tubing with cleanroom production, as well as cut-to-length, tip-forming assembly of complete devices and other solutions.
SERVICE
Thermal management
Compatherm, our range of thermally conductive materials, is used to facilitate the transfer of heat from hot components, for example on a PCB, to heat sinks and cold plates.